Quick answer

Yes — glass can be laser cut, but success depends on the glass type, the laser (ultrafast pulsed—picosecond or femtosecond—or short-wavelength pulsed lasers), fixturing, and often auxiliary methods (e.g., water-assisted cutting or mechanical cleaving). Desktop CO₂ or CW lasers are generally limited to etching and engraving, not high-quality structural cutting.

1. Which laser types can cut glass — and why

  • Ultrafast pulsed lasers (ps / fs): The industry standard for high-quality glass separation. Extremely short pulses create high peak power that drives nonlinear absorption and localized micro-damage (microvoids or modified zones) with minimal heat-affected zone (HAZ). This enables precision separation with low edge roughness and preserved mechanical strength.
  • Short-wavelength pulsed lasers (UV / green): Wavelengths such as 355 nm or 532 nm increase absorption in many glass types. They are commonly used for thin-sheet micro-cutting, high-precision holes, and decorative through-holes where controlled ablation is required.
  • CO₂ / continuous-wave lasers: Useful for engraving, etching, and decorative removal of material on glass surfaces, but poor choice for structural cutting due to large thermal stress, micro-cracking, and melt/residue.

2. What machines to use (machine types)

  • Industrial ultrafast pulsed laser platforms (ps / fs) with high-stability optics, power amplifiers, and precision motion stages or galvanometer scanners.
  • UV/short-wavelength micro-machining systems (355 nm pulsed) with small focal spots and multi-pass control for thin-glass work.
  • Water- or fluid-assisted laser platforms that combine laser optics with a thin liquid layer or immersion tank to reduce thermal stress and improve cut quality.

Note: These are industrial-class systems — not hobbyist desktop cutters. For production-grade, repeatable edge strength and yield, use an industrial partner or supplier.

3. Which types of glass can be laser cut

Glass type Can it be laser cut? Notas
Soda-lime (common window glass) Yes Thin to moderate thickness, typically with UV or ps/fs depending on finish requirements.
Borosilicate Yes More thermally stable; suitable for labware and some precision parts using ps/fs or water-assisted methods.
Aluminosilicate (e.g. some strengthened glasses) Yes (with specific processes) Display/cover glasses (e.g., chemically strengthened) can be cut with ultrafast lasers plus micro-perforation strategies.
Fused silica / quartz Yes High purity optical glass commonly processed with ultrafast or UV systems.
Tempered (heat-strengthened) glass No (practically not recommended) Internal residual stresses will cause catastrophic fracture if locally modified. Standard practice: cut before tempering.
Coated or stained glass Conditional Coatings change absorption and may require process validation.

4. How thick can you laser cut glass?

  • High-quality cuts are commonly demonstrated in the ~0.1–1.0 mm range (thin substrates and display glass). Many lab and industrial reports focus on 0.1–0.6 mm for best edge finish.
  • With specialized setups (micro-perforation + mechanical separation or Bessel-beam strategies) some industrial systems can process 1–3 mm while maintaining acceptable edge quality, but this depends strongly on glass type, fixture, and processing environment.

5. Advantages and limitations

Ventajas

  • Non-contact: no tool wear and minimal mechanical stress.
  • High geometric freedom: inner holes, complex contours, and fine features without tooling.
  • Ultrafast lasers can produce low-HAZ edges suitable for high-strength applications.

Limitaciones

  • Capital and operating costs are high for ultrafast laser systems.
  • Throughput for thick parts can be lower vs. waterjet or mechanical sawing for low-cost, high-volume needs.
  • Tempered glass cannot be safely processed after tempering.

6. How to laser cut glass — practical steps

  1. Material identification: Confirm glass chemistry, thickness, whether tempered, and presence of coatings.
  2. Choose laser and optics: For structural cuts on strengthened glass, prioritize ps/fs systems; for thin or decorative work, UV/green pulsed lasers may suffice.
  3. Fixturing and support: Use uniform support (vacuum tables or soft supports) to avoid point-load stresses. Minimize clamping-induced stress.
  4. Auxiliary media: Consider water-film, immersion, or gas flows to control debris and thermal stress for improved edge quality.
  5. Process strategy: Commonly: micro-perforation (internal modification) → controlled mechanical separation (cleave) or multi-pass surface ablation depending on the application.
  6. Post-process inspection: Edge roughness measurement, crack inspection (e.g., dye-penetrant or visual), and mechanical strength tests (e.g., bending/edge-strength tests).

7. Methods compared (concise table)

Method Typical laser Mechanism Typical uses
Internal micro-perforation (stealth dicing) ps / fs, Bessel/filament beams Create subsurface voids or modified plane; external force separates the part Display glass, high-precision optics
Surface ablation / multi-pass UV / short-pulse Layer-by-layer removal of material Thin-sheet parts, decorative cuts
Thermal cracking propagation High-energy pulses + mechanical Laser induces crack path that is propagated by mechanical means Research/limited industrial use for thicker plates

8. Real-world examples and references

  • Display glass manufacturing: Ultrafast laser-based methods are in use for cutting chemically strengthened cover glass (display industry). The approach reliably reduces edge damage compared with thermal methods.
  • Research demonstrations: Laboratory studies show femtosecond filamentation and ps micro-perforation can cut Gorilla®-type glass and fused silica with good edge quality, often in combination with immersion or water-film techniques.
  • Service providers: Some contract manufacturers and online quoting platforms list glass laser cutting in their capabilities — useful for prototyping and low-volume production where purchasing industrial equipment is not justified.

References & Further Reading